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May 27, 2013

• How Cortex-A15 Measures Up
  Now that Cortex-A15 is shipping in a smartphone (Galaxy S4), we can analyze its performance, power, and die area while comparing it with other A15-class CPUs from Apple and Qualcomm.
  

• Optical Transport Heats Up
  Broadcom and PMC-Sierra have expanded their OTN product lines in hopes of winning a larger share of the growing market for LAN/WAN/OTN framers and transport muxponders.
  

May 20, 2013

• Silvermont Energizes Atom
  Intel's 22nm Atom has received its first major CPU redesign in five years. Silvermont improves single-thread performance and scales to eight-core designs. It will appear in smartphones, tablets, embedded systems, and servers.
  

• Tabula’s Next-Generation FPGAs
  Tabula has announced its programmable 100GbE solution based on the second-generation Abax 3D programmable logic devices. The company’s offerings include reference designs as well as design tools.
  

May 13, 2013

• In Brief: Vitesse Jumps Ahead With MEF CE 2.0
  The Serval-2 Carrier Ethernet switch promises lower power and a lower price than competing products as well as MEF CE 2.0 readiness.
  

May 6, 2013

• Editorial: Intel Rewired
  SDN and NFV create opportunities for Intel to gain share in network-infrastructure equipment using combinations of Xeon processors, system logic, and 10G Ethernet switch chips.
  

April 29, 2013

• Foundries Stretch for FinFETs
  GlobalFoundries, TSMC, and other foundries are scrambling to catch up with Intel’s FinFET technology, and their processes are growing more complex and costly at 20nm and below.
  

April 22, 2013

• Photonics Cuts 100G Cost and Power
  Demonstrations of 100Gbps photonics by Cisco, Kotura, and OneChip are indicative of the industry's move towards photonic integrated circuits (PICs). PIC competition is heating up as data centers beckon with larger volumes.
  

April 15, 2013

• Centec Ethernet Switch Spans Markets
  Centec's new GreatBelt (CTC516x) offers a comprehensive Carrier Ethernet feature set for Gigabit and 10G Ethernet designs. It also adds enterprise features and reduces cost relative to the company’s shipping Humber switch chip.
  

April 8, 2013

• In Brief: MoSys Gears Up for PHYs
  MoSys has entered a new market with a gearbox PHY for 100G Ethernet. By offering decision-feedback equalization, the company is targeting line-card and long-reach applications.
  

April 1, 2013

• 10GbE-Over-Copper Takes Off
  After a long development period and multiple product generations, 10GbE-over-copper is finally ready for high-volume shipments. Aquantia and Broadcom have taken the early lead, but AppliedMicro and Marvell are targeting the next round of designs.
  

March 25, 2013

• Small Cells Surge at MWC
  New processors from Broadcom and Mindspeed are expanding the options for cellular base-station designers, and other announcements from this year’s Mobile World Congress reaffirm the industry's interest in small-cell technology.
  

• In Brief: Cadence Buys Tensilica for CPU IP
  Cadence is paying $380 million to purchase Tensilica. With chip companies facing soaring design costs, this acquisition shows the advantages of a business model focused on intellectual-property (IP) cores. 
  

March 18, 2013

• In Brief: Altera Locks Up Intel’s 14nm
  Altera has signed an agreement with Intel to manufacture its 14nm FPGAs. If the companies execute successfully, Altera will be in a position to win FPGA market share from archrival Xilinx.
  

March 11, 2013

• Silicon Photonics Light Up
  Silicon photonics could be the foundation of next-generation interconnects in data centers and beyond. Luxtera, Intel, Kotura, and Cisco are among those developing 100Gbps optical interconnects.
  

• Editorial: Welcome to Networking Report
  Our new weekly report brings you in-depth analysis of networking chips. The Linley Group has covered this market for more than a decade, and our latest publication offers subscribers timely access to our expertise.
  

• In Brief: MoSys Cranks Up 400Gbps Line Cards
  MoSys has updated its Bandwidth Engine (BE) for 400Gbps line cards. The new BE-2 family increases the serial-interface rate and adds more intelligence.
  

March 4, 2013

• Broadcom Freshens Enterprise LANs
  The new StrataXGS BCM56340 and BCM56547 unify wired and wireless networks with CAPWAP support. These GbE switch chips also improve integration, reducing the cost of stackable switches.
  

• In Brief: Ceva Extends XC DSPs
  The battle for the wireless baseband heated up again as Ceva announced new features for its flagship XC family of licensable DSPs.
  

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